Special PCB For MinLED

▪ Layer count  —— 8L

▪ HDI(2+N+2)

▪ Micro vias —— L1-L2, L2-L3, L6-L7, L7-L8

▪ Buried holes ——L2-L7

▪ Pad to Pad spacing —— 2.8mil

▪ Pad size ——3.0x3.0mil

▪ Surface Finishing —   ENEPIG  

Special PCB For MinLED
6L Sip IC Substrate

▪ Layer count——6L

▪ Material——DS7409-HGB

▪ Board thickness——0.5mm

▪ Copper Thickness——H/H oz

▪ Min. LW/LS——0.05/0.04mm

▪ Min. Drill Size ——0.07mm

▪ Surface Finish——ENEPIG

6L Sip IC Substrate
12L FCBGA

▪ Layer —— 12L  5+2+5

▪ Material —— MCL-E-705G+ABF GZ41

▪ Thickness —— 1.27mm

▪ Size —— 50*50 mm

▪ Copper Thickness —— 17 um

▪ Min Trace/Space —— 10/10 um

▪ Min Hole—— 50um

▪ Finishing —— IT+SOP


12L FCBGA
12L FCBGA

▪ Layer —— 12L  5+2+5

▪ Material —— MCL-E-705G+ABF GX-T31

▪ Thickness —— 1.1mm

▪ Size —— 70*70 mm

▪ Copper Thickness —— 17 um

▪ Min Trace/Space —— 15/15 um

▪ Min Hole—— 50um

▪ Finishing —— IT+SOP


12L FCBGA
20L BIB Board

▪ Layer—— 20L

▪ Material —— IT180ATC

▪ Board Thickness—— 2.35±0.1mm

▪ O/I Copper —— 0.5OZ 

▪ Min Trace/Space —— 0.072/0.255mm

▪ Min hole —— 0.131mm

▪ Pitch      —— 0.30mm

▪ Surface Finish—— ENIG+Gold Fingers

▪Application—— ATE

20L BIB Board
93K 48L Loadboad

▪ Layer —— 48L

▪ Material —— Panasonic R-5775G

▪ Thickness —— 6.35 mm

▪ Copper —— 35 um

▪ Min Trace/Space —— 2/2 mil

▪ Min hole —— 0.2mm

▪ Surface Finish —— Hard Gold



93K 48L Loadboad