CN
▪ Layer count —— 8L
▪ HDI(2+N+2)
▪ Micro vias —— L1-L2, L2-L3, L6-L7, L7-L8
▪ Buried holes ——L2-L7
▪ Pad to Pad spacing —— 2.8mil
▪ Pad size ——3.0x3.0mil
▪ Surface Finishing — ENEPIG
▪ Layer count——6L
▪ Material——DS7409-HGB
▪ Board thickness——0.5mm
▪ Copper Thickness——H/H oz
▪ Min. LW/LS——0.05/0.04mm
▪ Min. Drill Size ——0.07mm
▪ Surface Finish——ENEPIG
▪ Layer —— 12L 5+2+5
▪ Material —— MCL-E-705G+ABF GZ41
▪ Thickness —— 1.27mm
▪ Size —— 50*50 mm
▪ Copper Thickness —— 17 um
▪ Min Trace/Space —— 10/10 um
▪ Min Hole—— 50um
▪ Finishing —— IT+SOP
▪ Material —— MCL-E-705G+ABF GX-T31
▪ Thickness —— 1.1mm
▪ Size —— 70*70 mm
▪ Min Trace/Space —— 15/15 um
▪ Layer—— 20L
▪ Material —— IT180ATC
▪ Board Thickness—— 2.35±0.1mm
▪ O/I Copper —— 0.5OZ
▪ Min Trace/Space —— 0.072/0.255mm
▪ Min hole —— 0.131mm
▪ Pitch —— 0.30mm
▪ Surface Finish—— ENIG+Gold Fingers
▪Application—— ATE
▪ Layer —— 48L
▪ Material —— Panasonic R-5775G
▪ Thickness —— 6.35 mm
▪ Copper —— 35 um
▪ Min Trace/Space —— 2/2 mil
▪ Min hole —— 0.2mm
▪ Surface Finish —— Hard Gold