10L FCCSP

▪ Layer —— 10L

▪ Material —— MCL-E-705G+ABF GL102

▪ Thickness —— 0.24mm

▪Size —— 15*15 mm

▪Soldemask —— SR1

▪ Copper —— 15 um

▪Min Trace/Space —— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing—— ENEPIG


10L FCCSP
4L FCCSP ABF

▪ Layer —— 4L  1+2+1

▪ Material —— MCL-E-705G Or ABF GX92

▪ Thickness —— 0.2mm

▪ Size—— 67.19*50.1 mm

▪ Soldermask—— AUS308 or SR1

▪ Copper —— 17 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole —— 40mm

▪ Finishing ——ENEPIG

4L FCCSP ABF

4L FCCSP ABF
8W 4OZ Aluminum

 Layer —— 2L

▪ Material —— TCB-8

▪ Thickness—— 2.2 mm

▪ Copper —— 140 um

▪ Finishing —— LF-HASL



8W 4OZ Aluminum
U-Type Coin PCB

Layer —— 12L

▪ Material —— ISOLA370HR+COIN

▪ Thickness —— 2.2 mm

▪ Copper —— 140 um

▪ Finishing—— ENIG


U-Type Coin PCB
Single Copper base

▪ Layer —— 1L

▪ Material —— Copper Base

▪ Thickness—— 1.6 mm

▪ Copper —— 70 um

▪ Finishing —— ENIG



Single Copper base
High-Power Ceramic AIN

▪ Layer —— 1L

▪ Material —— 氮化铝陶瓷

▪ Thickness —— 1.2 mm

▪ Copper—— 35 um

▪ Finishing —— ENEPIG


High-Power Ceramic AIN