6L Sip IC Substrate
6L Sip IC Substrate

▪ Layer count——6L

▪ Material——DS7409-HGB

▪ Board thickness——0.5mm

▪ Copper Thickness——H/H oz

▪ Min. LW/LS——0.05/0.04mm

▪ Min. Drill Size ——0.07mm

▪ Surface Finish——ENEPIG

6L Sip IC Substrate