4L Multi FPC

▪ Layer —— 4L

▪ Material —— R-F775

▪ Thickness —— 0.3 mm

▪ Copper —— 75 um

▪ Finishing —— ENIG


4L Multi FPC
68L 6.4mm PCB


▪ Layer —— 68L

▪ Material—— FR408HR

▪ Thickness —— 6.4mm

▪ Copper —— 17 um

▪ Finishing —— ENIG


68L 6.4mm PCB
Embedded Capacitance/Resistance MIMO 4X4 Phased array Radar

Layer —— 12L

▪ Material —— RT5880+RO3003+FR28+Ticer+ECM2012

▪ Thickness —— 3.2 mm

▪ Copper —— 35 um

▪ Finishing —— ENEPIG


Embedded Capacitance/Resistance MIMO 4X4 Phased array Radar
14L Rigid-Flex

 Layer—— 14L    6+2+6  飞尾

▪ Material ——  R-FF75

▪ Thickness—— 2 mm

▪ Copper —— 50 um

▪ Finishing —— ENIG



14L Rigid-Flex
28L 9 Step HDI
▪ Layer —— 28L

▪ Material —— Panaconic R-5775

▪ Thickness—— 3.5mm

▪ Copper —— 1OZ

▪ Min Trace/Space —— 1.5/1.5mil

▪ Min hole—— 0.1mm

▪ Finishing —— ENEPIG

▪ Application —— Intel CPU Interposer


28L 9 Step HDI
10L 3OZ Heavy copper

▪ Layer count:10L

▪ Material:EM-827

▪ Board thickness:4.85mm

▪ Copper thickness on all layers: 3 oz(RTF)

▪ Min. LW/LS:0.45/0.30mm

▪ Min. Drill Size :0.25mm

▪ Surface Finish:ENIG

10L 3OZ Heavy copper