CN
▪ Layer —— 4L
▪ Material —— R-F775
▪ Thickness —— 0.3 mm
▪ Copper —— 75 um
▪ Finishing —— ENIG
▪ Layer —— 68L
▪ Material—— FR408HR
▪ Thickness —— 6.4mm
▪ Copper —— 17 um
Layer —— 12L
▪ Material —— RT5880+RO3003+FR28+Ticer+ECM2012
▪ Thickness —— 3.2 mm
▪ Copper —— 35 um
▪ Finishing —— ENEPIG
▪ Layer—— 14L 6+2+6 飞尾
▪ Material —— R-FF75
▪ Thickness—— 2 mm
▪ Copper —— 50 um
▪ Material —— Panaconic R-5775
▪ Thickness—— 3.5mm
▪ Copper —— 1OZ
▪ Min Trace/Space —— 1.5/1.5mil
▪ Min hole—— 0.1mm
▪ Application —— Intel CPU Interposer
▪ Layer count:10L
▪ Material:EM-827
▪ Board thickness:4.85mm
▪ Copper thickness on all layers: 3 oz(RTF)
▪ Min. LW/LS:0.45/0.30mm
▪ Min. Drill Size :0.25mm
▪ Surface Finish:ENIG