Eagle Driver HVLP3-HVLP4 Application Experience
Eagle Driver HVLP3-HVLP4 Application Experience

Release time:

2024-05-09
The classification of PCB copper foil is mainly divided according to its use and function, mainly including the following categories:1. Signal layer copper foil: used to ...
Core parameters of MEGTRON 8（U） material & practical applications of MEGTRON 8S（U） material
Core parameters of MEGTRON 8（U） material & practical applications of MEGTRON 8S（U） material

Release time:

2024-04-19
Recently, our Eagle-Driver have several new product PCBs. Due to their high heat-resistant and ultra-low transmission loss requirements, we recommend customer to use the ...
Eagle Driver Glass Core Substrate technology reference (Ion implantation coating)
Eagle Driver Glass Core Substrate technology reference (Ion implantation coating)

Release time:

2024-04-18
The glass-based chip is a concept given before the Intel 2023 Innovation Conference in SAN Jose, California, the United States, Intel announced this "landmark achievement...
Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline
Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline

Release time:

2023-09-06
Chip Embedded Package/Substrate is A new type of packaging method in which the chip or passive components are embedded between the metal layers inside the substrate, and ...
Eagle Driver support IC substrate Front-end DRCR Analysis
Eagle Driver support IC substrate Front-end DRCR Analysis

Release time:

2023-06-10
All IC Substrate, especially FCBGA or FCCSP with other high-end IC Substrate products, Eagle Driver will provide a detailed DRCR(Design Review and Change Request) report ...
MCPCB Thermal Conductivity use 3 different test Standard Report
MCPCB Thermal Conductivity use 3 different test Standard Report

Release time:

2023-06-09
Eagle Driver summarizes the different parameters of three different test standards for metal substrate high thermal conductivity sheets on the market.（D5470，ISO-22007,T02...