PCB material insertion damage test
PCB material insertion damage test

Release time:

2025-03-25
In the previous practice, we developed a high-speed backplane project together with the customer. The customer's loss redundancy space is very limited, and the PCB insert...
It's time to distinguish between high frequency and high speed in the context of PCB manufacturing
It's time to distinguish between high frequency and high speed in the context of PCB manufacturing

Release time:

2025-03-22
For a long time, in various industry-related articles and reports, there will often be "high-frequency high-speed"/" high-speed high-frequency "related words, especially ...
Congratulations Eagle Driver CPO successful delivery of the first large size 9+2+9 Co-packagedoptics
Congratulations Eagle Driver CPO successful delivery of the first large size 9+2+9 Co-packagedoptics

Release time:

2025-01-01
Congratulations Eagle Driver successful delivery of the first large size 9+2+9 Co-packagedoptics CPO  CPO(Co-packaged Optics) is an emerging optoelectronic integration te...
Eagle driver 10-layer thick copper & blind hole & cu-inlay production experience
Eagle driver 10-layer thick copper & blind hole & cu-inlay production experience

Release time:

2024-07-26
After 2 months of R&D and production, we Eagle Driver has once again completed this high-end, multilayer(10 layers) thick copper & blind vias & cu-inlay PCB board.  The s...
Eagle Driver HVLP3-HVLP4 Application Experience
Eagle Driver HVLP3-HVLP4 Application Experience

Release time:

2024-05-09
The classification of PCB copper foil is mainly divided according to its use and function, mainly including the following categories:1. Signal layer copper foil: used to ...
Eagle Driver Glass Core Substrate technology reference (Ion implantation coating)
Eagle Driver Glass Core Substrate technology reference (Ion implantation coating)

Release time:

2024-04-18
The glass-based chip is a concept given before the Intel 2023 Innovation Conference in SAN Jose, California, the United States, Intel announced this "landmark achievement...