▪ Layer —— 24L  11+2+11

▪ Material —— MCL-E-705G+ABF GL103

▪ Thickness —— 1.5mm

▪ Size —— 60*75 mm

▪ Copper thickness —— 17 um

▪ Min Trace/Space —— 9/12 um

▪ Min hole —— 50um

▪ Finishing —— IT+SOP

▪ Layer —— 10L

▪ Material —— MCL-E-705G+ABF GL102

▪ Thickness —— 0.24mm

▪Size —— 15*15 mm

▪Soldemask —— SR1

▪ Copper —— 15 um

▪Min Trace/Space —— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing—— ENEPIG

▪ Layer —— 4L  1+2+1

▪ Material —— MCL-E-705G Or ABF GX92

▪ Thickness —— 0.2mm

▪ Size—— 67.19*50.1 mm

▪ Soldermask—— AUS308 or SR1

▪ Copper —— 17 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole —— 40mm

▪ Finishing ——ENEPIG

▪ Layer count  —— 8L

▪ HDI(2+N+2)

▪ Micro vias —— L1-L2, L2-L3, L6-L7, L7-L8

▪ Buried holes ——L2-L7

▪ Pad to Pad spacing —— 2.8mil

▪ Pad size ——3.0x3.0mil

▪ Surface Finishing —   ENEPIG  

▪ Layer count——6L

▪ Material——DS7409-HGB

▪ Board thickness——0.5mm

▪ Copper Thickness——H/H oz

▪ Min. LW/LS——0.05/0.04mm

▪ Min. Drill Size ——0.07mm

▪ Surface Finish——ENEPIG

▪ Layer —— 12L  5+2+5

▪ Material —— MCL-E-705G+ABF GZ41

▪ Thickness —— 1.27mm

▪ Size —— 50*50 mm

▪ Copper Thickness —— 17 um

▪ Min Trace/Space —— 10/10 um

▪ Min Hole—— 50um

▪ Finishing —— IT+SOP