▪ Layer count：10L

▪ Material：TU865

▪ Board Thickness：3.5mm

▪ Copper thickness：5OZ

▪ Min. LW/LS：2/2mm

▪ Min. hole Size ：0.7mm

▪ Surface Finish：ENIG

▪ Application field：Communication

▪ Can be used for empty slots or PCB top and bottom

▪ Can be used for through-hole connection

▪ Number of floors - Four

▪ Materials -- S1000-2

▪ Board thickness - 1.58mm

▪ Overlay -- buried copper plate

▪ Blind Holes -- 1-2 Layer

▪ Minimum line width/line distance -- 0.1mm

▪ Surface treatment - Sinking gold

Application field -- Thermal control solutions

·Layer count —— 26L

·Material —— Tachyon 100G

·Board Thickness —— 3.5±0.35mm

·Copper thickness —— 0.33OZ 

·Min. LW/LS —— 0.118/0.051mm

·Min. hole Size —— 0.225mm

·Surface Finish —— ENIG

·Application field —— Industrial Control

▪ Layer —— 8L  3+2+3

▪ Material —— MCL-E-705G+ABF GL-102

▪ Thickness —— 0.76mm

▪ Size —— 30*30 mm

▪ Copper Thickness —— 17 um

▪ Min Trace/Space —— 10/10 um

▪ Min Hole—— 50um

▪ Finishing —— ENEPIG+IT+SOP

▪ Layer —— 18L

▪ Material —— TU865

▪ Thickness —— 3.5mm

▪ Copper —— 1OZ

▪ Min Trace/Space —— 2/2mil

▪ Min hole —— 0.2mm

▪ Finishing —— Plating Gold

▪ Application —— ATE

▪ Layer —— 2L

▪ Material—— Rogers4350B

▪ Thickness —— 1.6mm

▪ Copper —— 1OZ

▪ Min Trace/Space —— 2/2mil

▪ Min Hole —— 0.15mm

▪ Finishing —— ENEPIG

▪ Application —— Osat