▪ Layer —— 4L

▪ Material —— Panasonic R-705S

▪ Thickness —— 2mil PI

▪ Copper —— 1OZ

▪ Min Trace/Space—— 2/2mil

▪ Min Hole —— 0.1mm

▪ Finishing —— ENEPIG

▪ Stiffening  ——  AIN+Steel

▪ Layer —— 6L

▪ Material —— IT180A+R-F775

▪ Thickness—— 0.5mm

▪ Copper —— 1OZ

▪ Min Trace/Space —— 2/2mil

▪ Min Hole —— 0.15mm

▪ Finishing—— ENIG

▪ Application —— Intelligent wear

▪ Layer —— 6L

▪ Material —— IT180A+R-F775

▪ Thickness —— 1.5mm

▪ Copper —— 1OZ

▪ Min Trace/Space —— 2/2mil

▪ Min hole —— 0.2mm

▪ Finishing —— Immersion Gold

▪ Application ——Communication Devides

▪ Layer —— 14L

▪ Material —— ROGER4003C+Ticer+ECM2012

▪ Thickness —— 2.8mm

▪ Size —— 80X80 mm

▪ Copper —— 15 um

▪ Min Trace/Space —— 40/40 um

▪ Min Hole —— 70mm

▪ Finishing —— ENIG

▪ Layer —— 4L

▪ Material —— MCL-E-705G+ABF GL102

▪ Thickness —— 0.24mm

▪Size —— 15*15 mm

▪Soldermask —— SR1

▪ Copper —— 15 um

▪Min Trace/Space —— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing—— ENEPIG

▪ Layer—— 12L  5+2+5

▪ Material—— MCL-E-705G+ABF GL102

▪ Thickness —— 1.27mm

▪ Size—— 62.5*45 mm

▪ Copper —— 17 um

▪ Min Trace/Space —— 10/10 um

▪ Min Hole—— 50mm

▪ Finished —— IT+SOP