4L EMMC

▪Layer—— 4L

▪ Material —— MCL-E-705G

▪ Thickness —— 0.2mm

▪Copper —— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole —— 50mm

▪ Finishing —— ENEPIG+OSP


4L EMMC
4L DDR Memory IC Substrate

▪ Layer —— 4L

▪ Material —— HL832NXA

▪ Thickness —— 0.2mm

▪ Copper —— 15 um

▪ Min Trace/Space—— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing —— ENEPIG


4L DDR Memory IC Substrate
4L RF IC Substrate

▪ Layer —— 4L

▪ Material —— MCL-E-705G

▪ Thickness —— 0.24mm

▪Size —— 5*5 mm

▪ Copper —— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min Hole ——  Cu post

▪ Finishing——ENEPIG



4L RF IC Substrate
2L LGA

▪ Layer —— 2L

▪ Material —— HL832NXA

▪ Thickness —— 0.15mm

▪ Size —— 15*15 mm

▪ Copper —— 15 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole —— 50mm

▪ Finishing—— ENEPIG


2L LGA
12L 存储基板

▪ Layer—— 12

▪ Material —— MCL-E-705G

▪ Thickness—— 0.8mm

▪ Copper —— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole —— 50mm

▪ Finishing —— Soft GOLD  NPL process


12L 存储基板
4L PMIC BGA

▪ Layer —— 4L

▪ Material —— HL832NXA

▪ Thickness—— 0.6mm

▪ Size —— 13*10 mm

▪ Copper —— 25 um

▪ Min Trace/Space —— 35/35 um

▪ Min Hole —— 50mm

▪ Finishing —— ENEPIG


4L PMIC BGA