▪ Layer —— 12L Any Layer

▪ Material —— Nelco N4000-13SP

▪ Thickness —— 2.0mm

▪ Copper —— H OZ

▪ Min Trace/Space—— 2/2 Mil

▪ Min hole —— 0.1mm

▪ Finshing —— ENIG

▪ Application—— Communication Equipment

▪ Layer —— 4L  1+2+1

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer ——10L 1 Step

▪ Material —— TU872SLK 

▪ Thickness —— 2 mm

▪ Copper —— H OZ

▪ Min Trace/Space—— 2/2 Mil

▪ Min hole —— 0.1mm

▪ Finshing —— ENIG

▪ Application—— Communication Equipment

▪ Layer —— 4L  1+2+1

▪ Material —— HL972LD

▪ Thickness—— 0.32mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer —— 16L 3 Step

▪ Material —— Panasonic R-5775/R-5760

▪ Thickness—— 1.6mm

▪ Copper —— 1OZ

▪ Min Trace/Space —— 1/1 mil

▪ Min Hole—— 0.15mm

▪ Finishing —— ENIG 3u'+Gold Fingers 60u“

▪ Application —— FPGA

▪ Layer —— 4L  

▪ Material —— HL832NXA

▪ Size —— 40*40 mm

▪ Thickness—— 0.4mm

▪Copper—— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)