2L LGA
2L LGA

▪ Layer —— 2L

▪ Material —— HL832NXA

▪ Thickness —— 0.15mm

▪ Size —— 15*15 mm

▪ Copper —— 15 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole —— 50mm

▪ Finishing—— ENEPIG


2L LGA
12L 存储基板
12L 存储基板

▪ Layer—— 12

▪ Material —— MCL-E-705G

▪ Thickness—— 0.8mm

▪ Copper —— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole —— 50mm

▪ Finishing —— Soft GOLD  NPL process


12L 存储基板
4L PMIC BGA
4L PMIC BGA

▪ Layer —— 4L

▪ Material —— HL832NXA

▪ Thickness—— 0.6mm

▪ Size —— 13*10 mm

▪ Copper —— 25 um

▪ Min Trace/Space —— 35/35 um

▪ Min Hole —— 50mm

▪ Finishing —— ENEPIG


4L PMIC BGA
10L FCBGA
10L FCBGA

▪ Layer —— 10L  4+2+4

▪ Material —— MCL-E-705G+ABF GX92

▪ Thickness —— 1.0mm

▪ Size —— 45*45 mm

▪ Copper Thickness —— 17 um

▪ Min Trace/Space —— 10/10 um

▪ Min Hole—— 50um

▪ Finishing —— IT+SOP


10L FCBGA