▪ Layer —— 4L  1+2+1

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer—— 8L  3+2+3

▪ Material —— MCL-E-705G+ABF GL102

▪ Thickness —— 0.76mm

▪ Size —— 50*50 mm

▪Copper—— 17 um

▪ trace/space —— 10/10 um

▪ min hole —— 50um

▪ finishing—— IT+SOP

▪ Layer —— 4L  1+2+1

▪ Material—— MCL-E-705G

▪ Thickness —— 0.2mm

▪ Size —— 9*9  mm

▪ Soldermask —— AUS308

▪ Copper —— 15 um

▪ Min Trace/Space—— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing —— IT

▪ Layer —— 4L  1+2+1

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer —— 4L  1+2+1

▪ Material —— HL972LD

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer —— 2L 

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 75um

▪ Finishing —— ENEPIG