▪ Layer count——6L

▪ Material——DS7409-HGB

▪ Board thickness——0.5mm

▪ Copper Thickness——H/H oz

▪ Min. LW/LS——0.05/0.04mm

▪ Min. Drill Size ——0.07mm

▪ Surface Finish——ENEPIG

 ▪ Layer ——  4L  1+2+1

▪ Material —— HL832NS

▪ Thickness —— 0.32mm

▪ Size—— 50*50 mm

▪ Copper —— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole —— 50mm

▪ Finishing ——ENEPIG

▪ Layer —— 4L  1+2+1

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer —— 4L  1+2+1

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer —— 4L  1+2+1

▪ Material —— HL972LD

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)

▪ Layer —— 2L 

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 75um

▪ Finishing —— ENEPIG