DDR
DDR

▪ Layer —— 4L  1+2+1

▪ Material —— HL832NXA

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)


DDR
RFIC
RFIC

▪ Layer —— 4L  1+2+1

▪ Material —— HL972LD

▪ Thickness—— 0.32mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)


RFIC
4L NPL PBGA
4L NPL PBGA

▪ Layer —— 4L  

▪ Material —— HL832NXA

▪ Size —— 40*40 mm

▪ Thickness—— 0.4mm

▪Copper—— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)


4L NPL PBGA
4L EMMC
4L EMMC

▪Layer—— 4L

▪ Material —— MCL-E-705G

▪ Thickness —— 0.2mm

▪Copper —— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min hole —— 50mm

▪ Finishing —— ENEPIG+OSP


4L EMMC
4L DDR Memory IC Substrate
4L DDR Memory IC Substrate

▪ Layer —— 4L

▪ Material —— HL832NXA

▪ Thickness —— 0.2mm

▪ Copper —— 15 um

▪ Min Trace/Space—— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing —— ENEPIG


4L DDR Memory IC Substrate
4L RF IC Substrate
4L RF IC Substrate

▪ Layer —— 4L

▪ Material —— MCL-E-705G

▪ Thickness —— 0.24mm

▪Size —— 5*5 mm

▪ Copper —— 15 um

▪ Min Trace/Space —— 15/15 um

▪ Min Hole ——  Cu post

▪ Finishing——ENEPIG



4L RF IC Substrate