▪ Layer count  —— 8L

▪ HDI(2+N+2)

▪ Micro vias —— L1-L2, L2-L3, L6-L7, L7-L8

▪ Buried holes ——L2-L7

▪ Pad to Pad spacing —— 2.8mil

▪ Pad size ——3.0x3.0mil

▪ Surface Finishing —   ENEPIG  

▪ Layer—— 2L

▪ Material —— HL832NXA

▪ Thickness —— 0.0mm

▪ Copper —— 15 um

▪ Min hole —— 50mm

▪ Finishing —— ENEPIG