Eagle driver 10-layer thick copper & blind hole & cu-inlay production experience
Eagle driver 10-layer thick copper & blind hole & cu-inlay production experience

Release time:

2024-07-26
After 2 months of R&D and production, we Eagle Driver has once again completed this high-end, multilayer(10 layers) thick copper & blind vias & cu-inlay PCB board.  The s...
Eagle Driver HVLP3-HVLP4 Application Experience
Eagle Driver HVLP3-HVLP4 Application Experience

Release time:

2024-05-09
The classification of PCB copper foil is mainly divided according to its use and function, mainly including the following categories:1. Signal layer copper foil: used to ...
Eagle Driver Glass Core Substrate technology reference (Ion implantation coating)
Eagle Driver Glass Core Substrate technology reference (Ion implantation coating)

Release time:

2024-04-18
The glass-based chip is a concept given before the Intel 2023 Innovation Conference in SAN Jose, California, the United States, Intel announced this "landmark achievement...
Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline
Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline

Release time:

2023-09-06
Chip Embedded Package/Substrate is A new type of packaging method in which the chip or passive components are embedded between the metal layers inside the substrate, and ...
Eagle Driver support IC substrate Front-end DRCR Analysis
Eagle Driver support IC substrate Front-end DRCR Analysis

Release time:

2023-06-10
All IC Substrate, especially FCBGA or FCCSP with other high-end IC Substrate products, Eagle Driver will provide a detailed DRCR(Design Review and Change Request) report ...
MCPCB Thermal Conductivity use 3 different test Standard Report
MCPCB Thermal Conductivity use 3 different test Standard Report

Release time:

2023-06-09
Eagle Driver summarizes the different parameters of three different test standards for metal substrate high thermal conductivity sheets on the market.（D5470，ISO-22007,T02...