Congratulations Eagle Driver successful delivery of the first large size 9+2+9 Co-packagedoptics CPO
CPO(Co-packaged Optics) is an emerging optoelectronic integration technology, which refers to the coupling of silicon optical modules and CMOS chips in the form of advanced packaging on the backplane PCB, thus further improving the optical interconnection technology in data center applications in terms of cost, power consumption and size. It can integrate optical components and chips directly together, providing higher bandwidth, lower latency, and higher energy efficiency. The principle is that the optical component and the chip are packaged in the same package, and the optical signal is transmitted from the optical component to the chip through the microchannel, so as to achieve high-speed, low latency, and high energy efficiency optical transmission.
In terms of actual numbers, over the past 20 years, computer computing power (FLOPs) has grown by 60,000 times, while memory bandwidth has only grown by 100 times and I/O bandwidth has only grown by 30 times, resulting in a huge gap between computer computing power growth and computer computing power growth. In order to meet the increasing demand for computing power, but at the same time to pursue the reduction of energy consumption, semiconductor manufacturers have tried to integrate optical I/O technology through advanced packaging, in the combination of xPU (including CPU, DPU, GPU, TPU, FPGA and ASIC) and HBM AI chips to achieve optic-based interconnection. Significantly reduce the distance of data transmission, while achieving higher transmission speed and large bandwidth, and advanced packaging here refers to CPO.
It has higher rates and lower power consumption: CPO technology will continue to improve transmission rates and reduce power consumption to better meet the needs of high-performance computing and data centers. Higher integration and smaller size: CPO technology will continue to increase integration and shrink size to adapt to the needs of artificial intelligence, 5G communications and other devices. Wider application scenarios: CPO technology is expected to be more widely used in automotive, medical, industrial control and other fields.
Eagle Driver have been deeply engaged in FCBGA and FCCSP, as well as in advanced packaging fields such as 2.5D and 3D. We have accumulated rich experience and many practical cases in Flip Chip. Since September, we have received CPO production requirements from customers. A CPO of 9+2+9 in small and medium batches was made with ABFGX92R material, and our technical team immediately carried out in-depth analysis, which was completely feasible according to previous experience and the current configuration of the factory. After more than a month of hard work and testing, we finally conducted very careful data testing and shipment control according to the customer's parameters at the end of the year. Fully compliant with customer design performance.
Once again, congratulations Eagle Driver successful completion of small and medium-sized orders to overseas customers for the first time in China.
The following is part of the data and pictures manufactured by our company for your reference:
Stack up DFM
ABF Build up
Inner Build up circuit
Cavity Test
IT+SOP test
Bottom Layer
Coupon and Mircosection test
