Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline
Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline

Release time:

2023-09-06
Chip Embedded Package/Substrate is A new type of packaging method in which the chip or passive components are embedded between the metal layers inside the substrate, and ...
Eagle Driver support IC substrate Front-end DRCR Analysis
Eagle Driver support IC substrate Front-end DRCR Analysis

Release time:

2023-06-10
All IC Substrate, especially FCBGA or FCCSP with other high-end IC Substrate products, Eagle Driver will provide a detailed DRCR(Design Review and Change Request) report ...
MCPCB Thermal Conductivity use 3 different test Standard Report
MCPCB Thermal Conductivity use 3 different test Standard Report

Release time:

2023-06-09
Eagle Driver summarizes the different parameters of three different test standards for metal substrate high thermal conductivity sheets on the market.（D5470，ISO-22007,T02...
Eagle Driver IC Substrate Materials Breaking Voltage report
Eagle Driver IC Substrate Materials Breaking Voltage report

Release time:

2023-06-09
Eagle Driver specifically made a detailed Breaking Voltage test parameter report on Mitsubishi BT HL832 series materials, the specific information is as follows:
Eagle Driver Optical module products
Eagle Driver Optical module products

Release time:

2023-08-04
Eagle Driver Optical module products support 100G,400G,800G.`
Eagle Driver IGEPIG Plating process
Eagle Driver IGEPIG Plating process

Release time:

2023-07-31
Eagle Driver IGEPIG Plating process