Chip Embedded Package/Substrate is A new type of packaging method in which the chip or passive components are embedded between the metal layers inside the substrate, and the I/O of the chip or device are fan-out to the external pin through the micro-vias and metal layers. This chip embedded substrate allows surface area on top to place additional chips and passives devices on the top surface to gain higher integrated level of functionality in 3D stack-up. By using this innovated and customized process, all the components can be integrated in one packaged to form a new system-level package or module.Eagle Driver with the Domestic and Foreign Leading Company Organize the techinical literature for everyone 's reference and learning.