High Speed PCB
High Speed PCB

·Layer count —— 26L

·Material —— Tachyon 100G

·Board Thickness —— 3.5±0.35mm

·Copper thickness —— 0.33OZ 

·Min. LW/LS —— 0.118/0.051mm

·Min. hole Size —— 0.225mm

·Surface Finish —— ENIG

·Application field —— Industrial Control


High Speed PCB
T-Coin PCB
T-Coin PCB

Layer —— 12L

▪ Material —— ISOLA370HR+COIN

▪ Thickness —— 2.2 mm

▪ Copper —— 140 um

▪ Finishing—— ENIG


T-Coin PCB
10L 4OZ Heavy copper
10L 4OZ Heavy copper

▪ Industrial control systems

▪ Layer count：10L

▪ Material：EM370(Z)

▪ Board thickness：2.48mm

▪ Copper thickness ： 4 oz(RTF)

▪ Min. LW/LS：0.433/0.137mm

▪ Min. Drill Size ：0.3mm

▪ Surface Finish：ENIG


10L 4OZ Heavy copper
2 Level HDI 24 layers PCB
2 Level HDI 24 layers PCB


▪Layer count —— 24L

▪Material —— FR-4(Tg180) VT-47

▪Board thickness —— 2.59+/-0.26mm

▪Min. LW/LS —— 3.5/5.0mil

▪Min. Drill Size —— 0.25mm

▪Surface Finish —— Immersion gold


2 Level HDI 24 layers PCB
Square Coin PCB
Square Coin PCB

▪ Layer —— 10L

▪ Material —— ROGER4003C+370HR

▪ Thickness —— 1.6mm

▪ Size —— 100*80 mm

▪ Copper —— 35 um

▪ Min Trace/Space —— 2/2 mil

▪ Min Hole —— 0.2mm

▪ Finishing —— ENIG



Square Coin PCB
16L Xilinx FPGA
16L Xilinx FPGA

▪ Layer—— 16L 3 Step

▪ Material —— Isola FR408HR

▪ Thickness—— 3mm

▪ Copper —— HOZ

▪ Min Trace/Space —— 2/2mil

▪ Min Hole —— 0.15mm

▪ Finishing—— ENEPIG

▪ Application —— FPGA


16L Xilinx FPGA