FR4 Standard Tg

Shengyi, ITEQ, KB, Nanya

FR4 Mid Tg (Lead Free

Compatible)

Shengyi S1000, ITEQ IT158

FR4 High Tg

(Lead Free Compatible)

Shengyi S1000‐2, S1170
EMC EM827
Isola 370HR
ITEQ IT180A
Panasonic R1755V

High Performance

Low Loss FR4

EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola I‐Speed, I‐Tera MT
Nelco N4000‐13EP, EPSI
Panasonic R5775 Megtron 6

RF Materials

Rogers RO4350, RO3010
Taconic RF‐30, RF‐35, TLC, TLX, TLY
Taconic 601, 602, 603, 605

Halogen Free

EMC EM285, EM370(D)
Panasonic R1566

Aluminum Backed PCB

Shengyi SAR20, Yugu YGA

 Rigid Polyimide:  Shengyi SH260, Ventec VT901

 BT Epoxy:  Nelco and Mitsubishi

 High CTI FR4:  Shengyi S1600

 Flexible Circuit Materials:  Dupont, Panasonic, Taiflex, Shengyi 

Electroless Nickel Immersion Gold (ENIG)

Hot Air Solder Level (HASL, Lead and Lead‐free)

OSP, Immersion Tin,Immersion Silver, ENEPIG

Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold

Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM

Rigid‐Flex & Flexible Circuits

Y

Y

Buried and Blind Vias

Y

Y

Sequential Lamination

Y

Y

Impedance Control 

± 10%

± 5%

Hybrids & Mixed Dielectrics 

Y

Y

Aluminum PCB's 

Y

Y

Non‐Conductive Via Fill (VIP) 

Y

Y

Conductive Via Fill 

Y

Y

Cavity Boards 

Y

Y

Backdrilling

Y

Y

Controlled Depth Drill and Rout

Y

Y

Edge Plating 

Y

Y

Buried Capacitance

Y

Y

Etch Back

Y

Y

In‐board Beveling

Y

Y

2‐D Bar Code Printing

Y

Y