RF IC Substrate
RF IC Substrate

▪ Layer —— 4L  1+2+1

▪ Material —— HL972LD

▪ Thickness—— 0.24mm

▪Copper—— 17 um

▪ Min Trace/Space —— 25/25 um

▪ Min hole—— 50um

▪ Finishing —— Soft Gold (NPL Process)



RF IC Substrate