▪ Layer —— 3L

▪ Material —— PI

▪ Thickness —— 0.1mm

▪ Copper —— 17 um

▪ Min Trace/Space —— 15/15 um

▪ Surface Finish —— ENEPIG

 ▪ Layer —— 8L

▪ Material —— Rogers6010 + 370HR

▪ Thickness —— 2.2 mm

▪ Copper —— 75 um

▪ Finishing —— ENIG

▪ Layer —— 2L

▪ Material—— Rogers4350B

▪ Thickness —— 1.6mm

▪ Copper —— 1OZ

▪ Min Trace/Space —— 2/2mil

▪ Min Hole —— 0.15mm

▪ Finishing —— ENEPIG

▪ Application —— Osat

▪ Layer —— 10L

▪ Materail —— R-5775

▪ Thickness —— 2.2 mm

▪ Copper —— 75um

▪ Finishing —— ENIG

▪ Layer —— 12L

▪ Material —— RT5880+370HR

▪ Thickness —— 3.2 mm

▪ Copper —— 50 um

▪ Finishing —— ENIG

·22 Layer PCB

·High Speed Low Loss

·2 Lam- L22-3 and L1-22

·11 Sets of Back Drill, VIPPO

·20 T-Coins 22-3/3-1

·10 set of CI Single/Diff  

·HVLP Copper