4L FCCSP SR1
4L FCCSP SR1

▪ Layer —— 4L

▪ Material —— MCL-E-705G+ABF GL102

▪ Thickness —— 0.24mm

▪Size —— 15*15 mm

▪Soldermask —— SR1

▪ Copper —— 15 um

▪Min Trace/Space —— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing—— ENEPIG


4L FCCSP SR1
FCBGA 1944 IC Substrate
FCBGA 1944 IC Substrate

▪ Layer—— 12L  5+2+5

▪ Material—— MCL-E-705G+ABF GL102

▪ Thickness —— 1.27mm

▪ Size—— 62.5*45 mm

▪ Copper —— 17 um

▪ Min Trace/Space —— 10/10 um

▪ Min Hole—— 50mm

▪ Finished —— IT+SOP

FCBGA 1944 IC Substrate

FCBGA 1944 IC Substrate
FCBGA
FCBGA

▪ Layer—— 8L  3+2+3

▪ Material —— MCL-E-705G+ABF GL102

▪ Thickness —— 0.76mm

▪ Size —— 50*50 mm

▪Copper—— 17 um

▪ trace/space —— 10/10 um

▪ min hole —— 50um

▪ finishing—— IT+SOP

FCBGA
4L FCCSP
4L FCCSP

▪ Layer —— 4L  1+2+1

▪ Material—— MCL-E-705G

▪ Thickness —— 0.2mm

▪ Size —— 9*9  mm

▪ Soldermask —— AUS308

▪ Copper —— 15 um

▪ Min Trace/Space—— 15/15 um

▪ Min Hole —— 50mm

▪ Finishing —— IT


4L FCCSP
10L FCBGA
10L FCBGA

▪ Layer —— 10L  4+2+4

▪ Material —— MCL-E-705G+ABF GX92

▪ Thickness —— 1.0mm

▪ Size —— 45*45 mm

▪ Copper Thickness —— 17 um

▪ Min Trace/Space —— 10/10 um

▪ Min Hole—— 50um

▪ Finishing —— IT+SOP


10L FCBGA