Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline
Eagle Driver Chip Embedded Package/Substrate Solution Design Guideline

Release time:

2023-09-06
Chip Embedded Package/Substrate is A new type of packaging method in which the chip or passive components are embedded between the metal layers inside the substrate, and the I/O of the chip or device ...
Eagle Driver support IC substrate Front-end DRCR Analysis
Eagle Driver support IC substrate Front-end DRCR Analysis

Release time:

2023-06-10
All IC Substrate, especially FCBGA or FCCSP with other high-end IC Substrate products, Eagle Driver will provide a detailed DRCR(Design Review and Change Request) report in advance to help customers b...
MCPCB Thermal Conductivity use 3 different test Standard Report
MCPCB Thermal Conductivity use 3 different test Standard Report

Release time:

2023-06-09
Eagle Driver summarizes the different parameters of three different test standards for metal substrate high thermal conductivity sheets on the market.（D5470，ISO-22007,T0220  3 different test Standard)...
ISOLA material DataSheet Download
ISOLA material DataSheet Download

Release time:

2023-02-10
Isola Material Datesheet.rarEagle Driver provides various datasheet of ISOLA sheet for customers to download, because most of the European and American customers like to choose ISOLA sheet as the basi...
Eagle Driver IC Substrate Materials Breaking Voltage report
Eagle Driver IC Substrate Materials Breaking Voltage report

Release time:

2023-06-09
Eagle Driver specifically made a detailed Breaking Voltage test parameter report on Mitsubishi BT HL832 series materials, the specific information is as follows:
Eagle Driver Semiconductor Limited
Eagle Driver Semiconductor Limited

Release time:

2023-04-15
In order to better meet the specifications of the product and better service the needs of different types of customer products.In 2021, we Eagle Driver set up Eagle Driver Semiconductor Limited. ...